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Electrical Grounding and Bonding: Based on the 2005 National Electric Code (Electrical Grounding) | 
 enlarge | Author: Phil Simmons
Publisher: Delmar Cengage Learning
Category: Book
List Price: $69.95
Buy Used: $22.50
You Save: $47.45 (68%)
New (6) from $69.83
Avg. Customer Rating:  1 reviews
Sales Rank: 921081
Media: Paperback
Edition: 1
Number Of Items: 1
Pages: 320
Shipping Weight (lbs): 1.4
Dimensions (in): 10.6 x 8.3 x 0.6
ISBN: 1401859380
Dewey Decimal Number: 621.317
EAN: 9781401859381
ASIN: 1401859380
Publication Date: December 28, 2004
Availability: Usually ships in 1-2 business days
Shipping: Expedited shipping available
Condition: Satisfaction 100% guaranteed!
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| Editorial Reviews:
Product Description
Written in accordance with the 2005 National Electrical Code, this new book provides readers with a comprehensive introduction to the essential elements of electrical grounding and bonding. It examines the critical concepts of calculating conductor sizes, reading and interpreting NEC tables, the use of grounded conductor connections in DC and AC systems, as well as various installations and sizing. Material is reader-friendly and is accompanied by straightforward, easy-to-understand explanations of key concepts that foster understanding. A functional use of color and dynamic illustrations augments the book and further supports this thorough student- and professional-level approach to electrical grounding.
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| Customer Reviews:
Excellent Resource! August 2, 2008
This textbook does an excellent job of clearing up often misunderstood or confusing grounding and bonding issues (even the difference between boning and grounding as well!). Article 250 of the NEC is explained with clarity and completeness I've found in few other texts. The author's inclusion of reasoning behind the rules, with excellent illustrations, really helped me arrive at a more complete understanding of the subject. It is an indispensible resource for electricians, electrical contractors, instructors, or engineers designing electrical systems.
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